LED封装作为上下游产业端的连接点，起着承上启下的关键作用。在LED高光效化、功率化、高可靠性和低成本的发展下，对封装的要求随之提高。由此，封装行业近年来一直处于新材料、新工艺的快速驱动及发展阶段，新兴封装形式、技术层出不穷，诸如EMC、COB、倒装、CSP……，诸神争霸，LED氮化铝陶瓷基板这把称王神器将落入谁手？

As the connection point of upstream and downstream industry, LED encapsulation plays a key role in connecting the preceding and following. In LED, high efficiency power, high reliability and low cost of development, the packaging requirements increased. As a result, the packaging industry has been in the rapid drive and development stage of new materials and new technologies in recent years. Emerging packaging forms and technologies emerge in endlessly, such as EMC, COB, flip, and CSP... The gods, hegemony, LED aluminum nitride ceramic substrates of the king who will fall into the hands of artifact?

COB

COB

COB技术具有光线柔和、线路设计简单、高成本效益、节省系统空间、散热效果显着、高封装及输出密度等优点。虽然它还存在着芯片整合亮度、色温调和与系统整合的技术问题，但它带来的光品质提升效果是目前市场上单个大功率器件无法匹敌的，在照明用LED光源市场具有相当大的发展潜力。因此，全球LED封装企业不断地对COB封装技术进行升级，持续优化COB光源的产品寿命、可靠性与关键的发光效率。MCOB、AC-COB、倒装COB等号称“高品质、高效率、高性价比”的新兴COB技术随之涌现。

COB technology has such advantages as soft light, simple circuit design, high cost and efficiency, saving system space, significant heat dissipation effect, high encapsulation and output density. Although it also has the technical problems of integrated luminance, color temperature harmonization and system integration, the effect of optical quality improvement is unmatched by a single large power device on the market, and has considerable potential for the development of the LED light source market. Therefore, the global LED packaging enterprises constantly upgrade the COB packaging technology, and continuously optimize the life, reliability and key luminous efficiency of the COB light source. MCOB, AC-COB, flip chip COB and so on are called "high quality, high efficiency and cost-effective" emerging COB technology.

据了解，COB封装的球泡灯已经占据了LED灯泡40%左右的市场。它在商业照明领域的明显优势使之成为目前定向照明主流解决方案，未来或将成为封装领域的中流砥柱。

It is understood that COB encapsulated bulb has occupied about 40% of the market of LED bulbs. Its obvious advantages in the field of commercial lighting make it the mainstream solution of current directional lighting, and will become a mainstay in the field of packaging in the future.

COB明显是将LED氮化铝陶瓷基板运用到炉火纯青的，效果很明显，为其打下了大片的市场。

COB is obviously the LED aluminum nitride ceramic substrates mastery, the effect is obvious, for its laid a large market.

EMC

EMC

EMC实则是一种封装材料的变更。它具有高耐热、抗UV、高度集成、通高电流、体积小、稳定性高等特点，在对散热要求苛刻的球泡灯领域、对抗VU要求比较高的户外灯具领域及要求高稳定性的背光领域有突出优势。但是随着新蓝海CSP的出现，受到了相当大的威胁。

EMC is a change in a package material. It has the characteristics of high heat resistance, anti UV, high integration, high current, small volume, high stability and so on. It has a prominent advantage in the field of high heat dissipation, high demand for outdoor lighting and high stability backlight field. But with the emergence of new blue ocean CSP, it has been quite threatened.

倒装芯片

Flip chip

倒装芯片具小尺寸、功能性能增强、高可靠性、散热快的优点，但发展早期由于成本等原因，下游终端市场保持沉寂，近几年的技术突破使其应用范围越来越广，所占市场份额迅速提升。大部分封装企业已经将此封装技术作为重点研发、创新的方向。目前应用最多的就是COB倒装方面，从2107光亚展就可看出，其发展趋势势不可挡。

The flip chip has the advantages of small size, enhanced functional performance, high reliability and fast heat dissipation. However, the downstream terminal market remains silent in the early stages of development due to cost and other reasons. The technological breakthrough in recent years has made its application wider and wider, and the share of the market has increased rapidly. Most packaging enterprises have made this packaging technology a focus of R & D and innovation. At present, the most widely used is the COB inversion. From the 2107 light Asia exhibition, we can see that its development trend is irresistible.

CSP

CSP

无可厚非，CSP是时下封装行业最具话题性的封装形式，它光效低、焊接困难、光色一致性、成本价格高，但发光面小、高光密度、颜色均匀、体积小可增加应用端灵活性、成本下降空间潜力大，尤其在LED球泡灯、LED灯管等具极佳设计灵活度，成为各大企业争相抢夺的蓝海市场。CSP分为有基板和没有基板两种，目前无基板的CSP还仍然处于实验阶段，使用LED氮化铝陶瓷基板的中国式CSP慢慢兴起。

CSP is the most controversial package in the current packaging industry. It has low light efficiency, difficulty in welding, uniformity of light and color, high cost and price. However, the low luminous surface, high light density, uniform color and small volume can increase the flexibility of the application and have great potential for reducing the cost, especially in the LED bulb, LED lamp and so on. Good design flexibility has become the blue ocean market that every big business scrambled for. CSP is divided into two kinds of substrates, including substrates and no substrates. At present, the CSP without substrate is still in the experimental stage, and the Chinese CSP using LED aluminum nitride ceramic substrate is slowly rising.

RP

RP

RP封装技术的相对性能较为突出：一是荧光粉体远离LED芯片，荧光粉不易受PN结发热的影响，延长光源的寿命;二是荧光粉远离芯片设计的结构有利于光的取出，提高光源发光效率。三是光色空间分布均匀，颜色一致性高。在UV LED方面最近各大厂商都开始积极研发，因为LED氮化铝陶瓷基板的应用，使其具有无限的可能性，算是LED里的一片新蓝海。

The relative performance of RP packaging technology is more prominent: one is that the phosphor is far away from the LED chip, and the phosphor is not easily affected by the heat of PN junction to prolong the life of the light source; two, the structure of the phosphor far away from the chip is beneficial to the removal of the light and the efficiency of the light source. The three is that the spatial distribution of light and color is uniform, and the color consistency is high. In the UV LED, all the major manufacturers have begun to actively develop, because the application of LED aluminum nitride ceramic substrate has an infinite possibility, which is a new blue sea in the LED.

AC LED

AC LED

今年，SMD+IC、AC-COB成为各大封装企业的主推产品，国内封装企业尤为突出。似乎 “封装企业不再主推封装，反而是‘跨界’做AC模块，做集成类光源”。智能照明这块肥肉大家都想咬上一口，然而其核心还是传感器，氮化铝陶瓷基板的应用依然逃不脱。

This year, SMD+IC and AC-COB become the main products of the major packaging enterprises, especially the domestic packaging enterprises. It seems that encapsulation enterprises no longer advocate encapsulation, instead, they are "cross boundary" making AC modules, making integrated class light sources. We all want to bite the fat of the intelligent lighting, but the core is sensor, and the application of AlN ceramic substrate still can not escape.